The basic principle of silver soldering is capillary flow.
Everything that you do for strong sound joints and be successful is to promote that capillary flow.
For capillary flow to occur there must be a gap.
No gap = no flow = no joint
As described earlier, centre punching or roughing up the surface with a coarse file will help produce a 0.1mm gap. Placing foil in the joint will also work but consider using silver solder foil that you do not have to remove.
Pre-cleaning copper, chemically or otherwise, prior to silver soldering is often unnecessary
At the first instance that you apply heat, you create more oxide on the surface that you hve so painstakingly removed. Joint cleanliness, removing oxides and keeping the surface free of oxide, is the job of the flux. Simply make sure the joint is free of oil and grease which the flux cannot tackle. The temperatures involved will drive off any grease from the hands. Note. This comment does not apply when soft soldering
Use a flux that will operate for the heating period.
If necessary use a long life flux eg HT5. Its residues are more difficult to remove but clean the joint afterwards in 10% caustic soda. Flux which becomes exhausted will not keep the joint free of oxides.
The alloy will always flow to where it is hottest.
Heat the joint in the area to where you want the alloy to flow in relation to where you are applying the alloy. This ensures there are no cold spots in the joint that will cause the alloy to freeze, stop flowing and lead to a lack of penetration. As per Gary
HEAT THE JOINT NOT THE ALLOY
For more detailed information go to **LINK**
Stick to the principles af capillary flow and you will be successful!
Keith
Edited By CuP Alloys 1 on 13/01/2016 13:30:39