Posted by Jeff Dayman on 12/04/2018 16:12:49:
I've always tried for best cleanliness, enough good quality flux, and adequate heat when silver soldering, and have had consistently good results for many years. I typically leave a two or three thou gap between parts. I too read about Kozo Hiraoka's centre punch mark gap generation method many years ago and use it often.
Just my opinion and $0.02 worth.
Cleanliness is vital, i.e. surfaces to be joined should be free of grease, oxidation or any other contamination which might interfere with solder flow across the surfaces to be bonded.
When soldering silver and gold jewellery, or copper and brass for more utilitarian purposes, my aim has always been to get as close a fit as possible between the surfaces to be joined, not to consciously leave a gap. In practice there always is a gap, but ideally it will be the minimal kind of gap that can be achieved with accurate hand filing. A yardstick is that if I hold a ring shank before soldering up to the light and can see a chink of light passing through the joint anywhere, the gap is too large.
If the surfaces to be joined have been milled down to an accuracy of the kind found in gauge blocks, which "ring" together and stay together entirely of their own accord, and these surfaces are mechanically clamped together during soldering then quite probably the gap would be inadequate for good solder flow, but in practice I'd be surprised if the gaps left by most of us who pride ourselves on being competent solderers (and gauge this partly from how our work holds up over time) are ever too small for solder to properly flow into. Poor solder flow is nearly always a result of other factors than too tight a joint, and in my experience of people reporting problems with soldering, uneven, or slow or inadequate heating are the primary culprits, followed closely by insufficiently clean and insufficiently tight joints.
Edited By Bill Phinn on 12/04/2018 20:20:14
Edited By Bill Phinn on 12/04/2018 20:21:26